Plasmionique offers various Compact systems for cleaning, Reactive Ion Etching (RIE), Plasma-Enhanced Chemical Vapour Deposition (PECVD). Processes are carried out using RF or microwave generated plasma in low-pressure regimes.
Plasmionique’s Compact CVD / ALD / PECVD Systems seamlessly blend the efficiency of a Table Top form factor with the adaptability and upgradability of our larger models.
The systems typically measure 46” in height, 30” in width, and 25” in depth and have the following features:
- Deposition chamber having 8” – 10″ in diameter and about 6″ to 10” in height.
- Use of capacitively or inductively coupled plasma sources.
- Dry or wet mechanical pump with 6 to 9 cfm capacity. Addition of optional turbo pump station with nominal speed up to 80 to 90 L/s for ICP sources.
- Typically computer controlled, equipped with a programmable RF generator (120 W – 300 W) with its automatic matching network.
- Addition of optional water-cooled or heated (up to 300 °C) substrate holders. For ICP sources, optional addition of biased substrate holders.
- Optional axial motion (manual or automatic) substrate holder position control.
- Inclusion of substrates up to 4” in diameter.
- Incorporation of up to four (4) process gas lines and inclusion of an automated vent line.
All systems include the possibility to automate processes using recipes embedded within our PLASMICON control software. Additionally, all systems have an option to integrate optical spectroscopy for process monitoring/control.
An advanced control system is also included allowing full automation of the deposition process, a data acquisition system; real time data monitoring using a user-friendly 15” touch screen that also facilitates seamless interaction with the system control software.
Elevate your surface treatment capabilities with Plasmionique Compact systems, where innovation meets versatility.
