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Our Sputter Deposition Systems are versatile magnetron sputter deposition tools for thin-film coatings. The typical target sizes can range from one to four inches in diameter and could be operated with RF, DC or pulse-DC modes. Magnetron geometries can be balanced or unbalanced. Substrate rotation, heating, and biasing are used to control the sputter deposition process.

These systems can include ICP and Ion Sources for Enhanced Reactive Sputter Deposition. Substrate rotation, heating, biasing, and computer controlled axial motions are options available on all systems.

Products

This product can be integrated in the following system formats:

Table Top

Plasmionique’s Table Top Sputter Deposition Systems are designed to serve as versatile surface treatment systems…

Compact

Plasmionique’s Compact Sputter Deposition Systems seamlessly blend the efficiency of a Table Top form factor…

Full Size

Plasmionique’s Full Size Sputter Deposition Systems are designed for unparalleled flexibility and feature-rich functionality. This…

Roll-To-Roll

Plasmionique’s Roll-To-Roll Sputter Deposition Systems accommodate an extensive array of sources, processes, and features, empowering…

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